Fracture of device (Q53099)
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Problem associated with a partial or full-thickness crack in the device materials.
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | XE1M6 |
||
| English | Fracture of device |
Problem associated with a partial or full-thickness crack in the device materials. |
Statements
CID11:XE1M6
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dki-india-XE1M6
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Concluído
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13 August 2026
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