Fracture of device (Q53099): Difference between revisions

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Problema associado a uma fissura parcial ou total nos materiais do dispositivo.
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Problem associated with a partial or full-thickness crack in the device materials.

Revision as of 00:30, 14 August 2026

Problem associated with a partial or full-thickness crack in the device materials.
Language Label Description Also known as
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XE1M6
    English
    Fracture of device
    Problem associated with a partial or full-thickness crack in the device materials.

      Statements