Material split, cut or torn (Q67907): Difference between revisions

@@ description / pt-br / description / pt-br @@
+Problemas associados aos materiais componentes do dispositivo que são rachados, cortados ou rasgados devido a forças externas (por exemplo, torção ou laceração) ou forças internas (por exemplo, excedendo os limites de tensão de tração dos materiais usados na construção do dispositivo).
@@ description / en / description / en @@
+Problem associated with materials composing the device being split, cut or torn due to external forces (e.g. wrenching or laceration) or internal forces (e.g. exceeding the tensile stress limits belonging to the materials used in the device construction).
@@ Property / Canonical URI @@
+https://id.who.int/icd/entity/599171517
@@ Property / Canonical URI: https://id.who.int/icd/entity/599171517 / rank @@
+Normal rank
@@ Property / CURIE @@
+CID11:XE4FP
@@ Property / CURIE: CID11:XE4FP / rank @@
+Normal rank
@@ Property / Canary Token @@
+dki-india-XE4FP
@@ Property / Canary Token: dki-india-XE4FP / rank @@
+Normal rank
@@ Property / Verification Status @@
+Concluído
@@ Property / Verification Status: Concluído / rank @@
+Normal rank
@@ Property / Knowledge Architect @@
+https://pauloleads.com.br/cases-publicos/
+Normal rank
@@ Property / Collection date @@
+August 2026Timestamp +2026-08-13T00:00:00Z
Timezone +00:00
Calendar Gregorian
Precision 1 day
Before 0
After 0
-Timestamp
++2026-08-13T00:00:00Z
-Timezone
++00:00
-Calendar
+Gregorian
-Precision
+day
 Before
 After
@@ Property / Collection date: 13 August 2026 / rank @@
+Normal rank

Latest revision as of 15:44, 14 August 2026

Problem associated with materials composing the device being split, cut or torn due to external forces (e.g. wrenching or laceration) or internal forces (e.g. exceeding the tensile stress limits belonging to the materials used in the device construction).

Language	Label	Description	Also known as
default for all languages	XE4FP
English	Material split, cut or torn	Problem associated with materials composing the device being split, cut or torn due to external forces (e.g. wrenching or laceration) or internal forces (e.g. exceeding the tensile stress limits belonging to the materials used in the device construction).