Packaging of device compromised problem identified (Q61414): Difference between revisions
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| Property / Knowledge Architect: https://pauloleads.com.br/cases-publicos/ / rank | |||||||||||||||
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13 August 2026
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Latest revision as of 08:53, 14 August 2026
Problems that occurred because of a compromised packaging of the device (e.g. broken or incomplete seal).
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | XE9F7 |
||
| English | Packaging of device compromised problem identified |
Problems that occurred because of a compromised packaging of the device (e.g. broken or incomplete seal). |
Statements
CID11:XE9F7
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dki-india-XE9F7
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Concluído
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13 August 2026
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