Solder joint fracture (Q53145): Difference between revisions
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13 August 2026
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Latest revision as of 00:34, 14 August 2026
Problem associated with undesired damage or breakage in a solder joint of materials used in the device construction.
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | XE82N |
||
| English | Solder joint fracture |
Problem associated with undesired damage or breakage in a solder joint of materials used in the device construction. |
Statements
CID11:XE82N
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dki-india-XE82N
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Concluído
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13 August 2026
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