Solder joint fracture (Q53145): Difference between revisions
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| Property / Canonical URI: https://id.who.int/icd/entity/1870105218 / rank | |||||||||||||||
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CID11:XE82N | |||||||||||||||
| Property / CURIE: CID11:XE82N / rank | |||||||||||||||
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dki-india-XE82N | |||||||||||||||
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Concluído | |||||||||||||||
| Property / Verification Status: Concluído / rank | |||||||||||||||
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| Property / Knowledge Architect: https://pauloleads.com.br/cases-publicos/ / rank | |||||||||||||||
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13 August 2026
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| Property / Collection date: 13 August 2026 / rank | |||||||||||||||
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Latest revision as of 00:34, 14 August 2026
Problem associated with undesired damage or breakage in a solder joint of materials used in the device construction.
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | XE82N |
||
| English | Solder joint fracture |
Problem associated with undesired damage or breakage in a solder joint of materials used in the device construction. |
Statements
CID11:XE82N
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dki-india-XE82N
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Concluído
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13 August 2026
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